300mm Post-CMP Wet Transfer
This is the first of its kind Wafer Transfer System that transfers wafers while submerged in DI water. These 300mm wafers have just undergone a chemical/mechanical planarization (CMP). A slurry residue that remains on the wafers can cause defects if it is allowed to dry. For this reason, the wafers must remain wet until the slurry can be removed in a cleaning system. This machine is needed to transfer the wafers from the CMP cassettes to the cleaning carrier. As soon as the operator loads a cassette onto the system, it is lowered into the water tank. When both cassettes and the cleaning carrier are in the tank, the transfer takes place, keeping the wafers underwater. The cleaning carrier and wafers stay in the tank until an operator is ready to load them directly into the cleaning system.
This machine was built for a major wafer foundry in Asia where it was installed in 2007.